RMA-424 T3-T6 - Sn42Bi57.6Ag0.4 low-temperature no-clean rosin mildly active solder paste 0.4% silver (ROL0) F Low QC-Aid™ No Yes

Low QC-Aid™ No Yes

micro-alloyed lead-free solder wire engineered for high-reliability selective soldering

such as inadequate thermal vias or insufficient copper thickness

By addressing these factors

this polo features our logo and offers exceptional performance for your workouts or everyday wear

RMA-424 T3-T6 - Sn42Bi57.6Ag0.4 low-temperature no-clean rosin mildly active solder paste 0.4% silver (ROL0) F Low QC-Aid™ No YesLow temp solder paste for electronics assembly using rosin mildly activated solder tacky paste flux Used for attachment of temperature sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low temperature reflow. Solders low Tg flexible boards and circuits used in phones, wearables and IoT devices Low temp BGA paste reduces HIP (head