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MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipation

MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipation

Name: MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipation
Brand: jftbasic.com
SKU: 956010331
Price: 21.42 USD
Availability: InStock
Rating: 4.4509 (18 reviews)

SKU: 956010331

4.5

USD21.42 USD51.42

Pay in 4 interest-free payments of $5.36 Learn more

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Ships within 48 hours · Estimated delivery Aug 3 - Aug 8

Live Spec

MJ BGA Reballing Solder Stencil Plant Tin Net for MTK CPU OPTION:MT-2 heat dissipationPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Store: jftbasic.com · Domain: jftbasic.com

Description

heat dissipation

four foot silicone pad anti-skid

Put the sillica gel on the heated plate holes to holes

Machine Power: 200W

Gas flow rate:100 litres/minute

Exchange/Return Notes