MJ BGA Reballing Solder Stencil Plant Tin Net For Samsung C7010/J610 general C7/J3/J5/A5 series and other MSM8916/MSM8953 B01-AB CPU general series Connector flex SMD reworking
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MJ BGA Reballing Solder Stencil Plant Tin Net For Samsung C7010/J610 general C7/J3/J5/A5 series and other MSM8916/MSM8953 B01-AB CPU general series Connector flex SMD reworkingPRODUCT INTRODUCTIONType: Hand Tool PartsOrigin: CN(Origin)is_customized: NoMaterial: Aluminium copper AlloyUsage: Commercial Manufacture PRODUCT FEATURES* Stepped groove design enables stencil to align with the tinning position of ic rapidly.* The square holes design makes it easier to take out the formed solder balls.* The high success rate of planting tin, the solder balls can be formed once after you are proficient.
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